Flux
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Spring produces all kinds of flux such as active rosin (RA), moderately active rosin (RMA), disposable (NO CLEAN) and water (Water Soluble), suitable for all kinds of electrical assembly process. The selection of the correct type of Flux is extremely urgent and important. Flux chosen must be able to remove the oxide components and the substrate table in order to achieve good solder water vapor permeability. Spring Fluxes are formulated to the optimum level of activity to meet the needs of a variety of applications.
◆Continuous research and development
◆Control processes
◆Good Technical support
◎Water-soluble Solder Resist
| Product ID | Flux Type | Solid Content | SG@25℃ Proportion | Rating Type |
|---|---|---|---|---|
| Spring-Z1 | Halogen, Organic Water-soluble Flux | 21% | 0.875 | ORH0 |
| Spring-Z2 | Water-soluble Flux | 16% | 0.875 | ORH1 |
◎Disposable Flux
| Product ID | Flux Type | Solid Content | SG@25℃ Proportion | Rating Type |
|---|---|---|---|---|
| Spring-Z9 | Halogen-free, disposable Flux Halogen Free No Clean Flux | 4.0% | 0.791 | ROL0 |
| Spring-Z7 | Halogen-free, disposable Flux Halogen Free No Clean Flux | 6.0% | 0.800 | ROL0 |
| Spring-Z88 | Disposable Flux No Clean Flux | 6.0% | 0.802 | ROL1 |
| Spring-Z8 | Disposable Flux No Clean Flux | 15.0% | 0.823 | ROL1 |
- Without Halogen defined in accordance with standard IPC 4101B,IEC 61249-2-21 and JPCA-ES01
◎Water-soluble Solder Resist
| Product ID | Flux Type | Solid Content | SG@25℃ Proportion | Rating Type |
|---|---|---|---|---|
| Spring-Z3 | RA Rosin Flux | 90% | 0.820 | － |
- High insulation resistance.
- No cleaning required
- Non corrosive
- Minimum residue,uniform spread,quick dry & does not absorb water Full & even wielding
- Pass copper corrosion & mirror tests
- Good welting force, reduce surface tension of solder
- Halogen free, contains no other hazardous materials
- No residue, clean, dry and not sticky after soldering
- Excellent solder joint with shining surface, effectively preventing a insufficient solder join and short circuit Good mix of additives effectively reduces a the effect of a bad solder ball joint
- No flux or corrosive residues, lead & halogen free, no cleaning required
- Very high surface insulation resistance, meet IPC standards with no cleaning, high electrical reliability Less smoke, non pollutive and health hazardous
- No change in process or equipment
- Specially designed for use in solar module assembly
- Fast wetting
- Non corrosive
- Low solid content results in high electrical reliability and a clean finishing High surface insulation resistance
◎Disposable Flux
| Melting Point | 71 ℃ |
|---|---|
| Flourine Content | Pass |
| Halide Content | Pass |
| Copper Corrosion Test | Pass |
| Spread Factor | ≥ 85% |
| Wetting Speed | Pass |
| Surface Insulation Resistance | 1.3 × 1011Ω |
| Rosin Content | 0.5 ~ 1.8% as per customer’s requirements |